EPOXYEPO-TEK301 Epoxy Resin Semiconductor LED Optical Adhesive, Low Viscosity, High Refractive Index, Thermal Curing AB Adhesive

EPOXY 301 is used for medical purposes.

EPOXY 302 is generally used for infrared detectors,

EPOXY

Application Points and Uses:

Semiconductor: Optical ball top or underfill; connects common wafer passivation, solder masks, and flexible circuits; compatible with LED dies, Si, and gallium arsenide.

PCB: General potting and protection on FR4, flexible, or ceramic PCBs.

Fiber Optics: Adhesives for glass and plastic fibers; fiber bundles for wire bonding, endoscopes, or sensor devices; adhesives/sealants/encapsulants for fiber packaging and assemblies; infrared transmission up to 2500 nm; connecting fibers into ferrules; fiber coupling and splicing.

Optoelectronics: LCD/LED adhesives for composite glass layers; adhesion to PET plastics; general sealing, encapsulation, and protection; spectral transmission of VIS and IR light; adhesives/encapsulants for VCSEL packaging equipment; compliant with ASTM D1925; precision optical adhesives, including lenses, prisms, beam splitter cubes, mirrors, and diodes, found in medical, university, or research fields.